KLA Corporation's Growth and Market Dynamics in Semiconductor Equipment at JPMorgan's 53rd Annual Technology Conference

Key Takeaways

TL;DR: KLA (KLAC) anticipates low DD growth in FY25 (+2025) fueled by leading-edge logic/foundry (2nm/HPC), HBM, and advanced packaging (+70% YoY growth). Process control intensity rises to ~8% of WFE, surpassing WFE’s mid-SD growth. Margin resilience (GM: 62.5%; OpEx leverage: 40-50%) despite 100bps tariff headwind. AI/ML integration enhances defect analytics; advanced packaging SAM expands.


1. WFE & Process Control Dynamics

2. Advanced Packaging ($850M in FY25; +70% YoY)

3. Tariffs & Supply Chain

4. AI/ML Integration & R&D

5. Market Share & Key Opportunities